METHOD AND DEVICE OF CUTTING PLASTIC BY USING LASER BEAM

摘要

PROBLEM TO BE SOLVED: To provide a method and device for cutting plastic without substantially destroying or changing the chemical or physical characteristics of materials. SOLUTION: The device for removing the materials from workpieces (14) includes plural lasers (12) which transmit plural laser beams (20) to the workpiece along a common cutting line (16) and a moving means (22) which moves the workpieces at a prescribed speed with respect to the plural laser beams. The respective laser beams are isolated from each other at prescribed intervals so as to remove the materials from the workpieces. Accordingly, the secondary cleaning work to the workpieces is considerably decreased.