发明名称 EPOXY RESIN COMPOSITION, PREPREG, AND, METAL-CLAD LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition in which a phenol-modified polyphenylene oxide reacts in a high rate, and to provide a prepreg and a metal-clad laminate which use the epoxy resin composition. SOLUTION: This epoxy resin composition comprising an epoxy resin, a phenol-modified polyphenylene oxide having a number-average mol.wt. of 1,000 to 4,000 and obtained by reacting polyphenylene oxide with a phenol compound in a redistribution reaction in the presence of a reaction initiator, and a curing agent. The reaction initiator is decomposed to produce an alcohol.
申请公布号 JP2003002965(A) 申请公布日期 2003.01.08
申请号 JP20010225741 申请日期 2001.07.26
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 MAEKAWA TETSUYA;YOSHIMURA TAKESHI;HAYASHI TAKAO;SAITO EIICHIRO;KOMORI KIYOTAKA
分类号 C08J5/24;C08G59/62;C08G65/48;C08L71/12;H05K1/03;(IPC1-7):C08G65/48 主分类号 C08J5/24
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