发明名称 |
EPOXY RESIN COMPOSITION, PREPREG, AND, METAL-CLAD LAMINATE |
摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition in which a phenol-modified polyphenylene oxide reacts in a high rate, and to provide a prepreg and a metal-clad laminate which use the epoxy resin composition. SOLUTION: This epoxy resin composition comprising an epoxy resin, a phenol-modified polyphenylene oxide having a number-average mol.wt. of 1,000 to 4,000 and obtained by reacting polyphenylene oxide with a phenol compound in a redistribution reaction in the presence of a reaction initiator, and a curing agent. The reaction initiator is decomposed to produce an alcohol. |
申请公布号 |
JP2003002965(A) |
申请公布日期 |
2003.01.08 |
申请号 |
JP20010225741 |
申请日期 |
2001.07.26 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
MAEKAWA TETSUYA;YOSHIMURA TAKESHI;HAYASHI TAKAO;SAITO EIICHIRO;KOMORI KIYOTAKA |
分类号 |
C08J5/24;C08G59/62;C08G65/48;C08L71/12;H05K1/03;(IPC1-7):C08G65/48 |
主分类号 |
C08J5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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