| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide resin-type liquid composition suitably used as a material for protecting semiconductor devices, whose cured product gives good heat resistance and electrical properties and low stress properties. SOLUTION: The liquid resin composition contains (a) a polyamic acid or a soluble polyimide, (b) silicone fine particles made by coating silicone rubber globular particles with a polyorganosilsesquioxane resin, and (c) an organic solvent.
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