SHOWER HEAD FOR PROCESSING APPARATUS OF SEMICONDUCTOR WAFER

摘要

PURPOSE: A shower head for processing apparatus of a semiconductor wafer is provided to inject two kinds of process gases by forming a distribution plate as a dual structure. CONSTITUTION: A process chamber(301) is used for forming a processing space. A susceptor(303) is installed at a center portion of the process chamber(301) in order to load a wafer(W). A shower head(400) is installed at an upper side of the process chamber(301) in order to inject the first and the second process gases of the first and the second process gas supply source(305,306) into the inside of the process chamber(301). The shower head(400) is formed with a manifold(410) for receiving the first and the second process gas and a distribution plate(430) for injecting the first and the second process gas of the manifold(410) into the inside of the process chamber(301). The first and the second gas supply hole(411a,411b) are formed at an upper portion of the manifold(410). The manifold(410) has one barrier portion(412) for forming the first and the second buffer space portion(413,415). A plurality of circular barriers(431) are formed in the inside of the distribution plate(430).