发明名称 LASER BEAM MACHINING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a laser beam machining device with which a work to be machined is cut without causing a molten surface or a crack strayed from an intended line to be cut on the surface of the work to be machined. SOLUTION: The laser beam machining device 100 is provided with a laser light source 101 which emits a laser beam L of which pulse width is 1μs or smaller, means 401 which adjusts the power of the laser beam on the basis of an input, a condenser lens 105 which condenses the laser beam so that the peak power density of the laser beam at a condensed point P of the laser beam becomes 1×10<8> (W/cm<2> ) or greater, a means 405 which adjusts the aperture number of an optical system including the condenser lens on the basis of an input, a means 113 with which the condensed point of the laser beam is aligned with the inner part of the work 1 to be machined, means 109 and 111 which move the condensed point of the laser beam along the intended line to be cut 5, a means 127 which preliminarily storages the correlation between a combination of the power magnitude of the laser beam and the aperture number and the dimension of a modified spot and selects the dimension of the modified spot formed with an inputted value and a means 129 which displays the dimension.</p>
申请公布号 JP2003001451(A) 申请公布日期 2003.01.08
申请号 JP20020097656 申请日期 2002.03.29
申请人 HAMAMATSU PHOTONICS KK 发明人 FUKUYO FUMITSUGU;FUKUMITSU KENJI;UCHIYAMA NAOKI;WAKUTA TOSHIMITSU
分类号 B28D5/00;B23K26/00;B23K26/04;B23K26/40;B23K101/40;C03B33/09;H01L21/301;(IPC1-7):B23K26/00 主分类号 B28D5/00
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