发明名称 LASER BEAM MACHINING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a laser beam machining device with which a work to be machined is cut without causing a molten surface or a crack strayed from an intended line to be cut on the surface of the work to be machined. SOLUTION: The laser beam machining device 100 is characterized by the fact that the device is provided with a laser light source 101 which emits a laser beam L of which pulse width is 1μs or smaller, a condensing means 105 which condenses the laser beam so that the peak power density of the laser beam at a condensed point P becomes 1×10<8> (W/cm<2> ) or greater, a means 113 with which the condensed point of the laser beam is aligned with the inner part of the work 1 to be machined, moving means 109 and 111 which relatively move the condensed point along the intended line to be cut 5, a speed adjustment means 115 which adjusts the magnitude of the relative moving speed of the condensed point and a speed calculation means 127 which calculates the magnitude of the relative moving speed of the condensed point in order to make the distance between adjacent reformed spots an input value, and the speed adjustment means adjusts the magnitude of the relative moving speed of the condensed point so that the speed becomes the calculated value.</p>
申请公布号 JP2003001446(A) 申请公布日期 2003.01.08
申请号 JP20020097317 申请日期 2002.03.29
申请人 HAMAMATSU PHOTONICS KK 发明人 FUKUYO FUMITSUGU;FUKUMITSU KENJI;UCHIYAMA NAOKI;WAKUTA TOSHIMITSU
分类号 B28D5/00;B23K26/00;B23K26/04;B23K26/40;B23K101/40;C03B33/09;H01L21/301;(IPC1-7):B23K26/00 主分类号 B28D5/00
代理机构 代理人
主权项
地址