| 摘要 |
PURPOSE: A bonding pad of a semiconductor device is provided to form more patterns in the same area and to effectively design the device while the problem arising from an increased area of the bonding pad is solved. CONSTITUTION: A dummy wafer(41) is attached to the upper surface of a wafer whose back side is ground. The first process is performed on the wafer having an interconnection(35). An insulation layer(37) is formed on the ground back side of the firstly processed wafer. A contact hole is so formed to expose the lower surface of the interconnection layer from the back side of the first processed wafer. A sidewall spacer(38) is formed on the side surface of the contact hole. A contact plug(39) is so formed in the contact hole to come in contact with the lower surface of the interconnection layer. The bonding pad(40) extends to the insulation layer, in contact with the contact plug.
|
