发明名称 |
METHOD FOR DESIGNING AND MANUFACTURING ELECTRONIC COMPONENTS AND PRODUCTION JIG |
摘要 |
PURPOSE: A method for designing and manufacturing electronic components and a production jig is provided to enhance productivity and reduce a manufacturing cost by improving a production process and a manufacturing method to reduce an error rate. CONSTITUTION: A guide hole formation process is performed to form a plurality of guide holes(102,103). A heat-sink path, and an air and gas exhaust path formation process are performed to form a heat-sink path(205) and an air and gas exhaust path. A heat-sink hole is formed on a heat-sink plate and reinforcement plate(201) if a drawing of the heat-sink plate and reinforcement plate(201) is designed to reduce bubbles in a hot press process. A corrosion and sanding surface is processed by performing a corrosion and sanding work. A gas exhaust hole(202) is formed if a projected part is generated on the heat-sink plate and reinforcement plate(201).
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申请公布号 |
KR20030001773(A) |
申请公布日期 |
2003.01.08 |
申请号 |
KR20010037131 |
申请日期 |
2001.06.27 |
申请人 |
SAMSHIN CIRCUIT CO., LTD. |
发明人 |
MIN, TAEK GI |
分类号 |
H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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