发明名称 SUBSTRATE TREATMENT EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To suppress the futile consumption of a treating liquid, such as an etchant, by building a recovering unit of removing metal ions into the equipment, thereby performing liquid discharge treatment with simple constitution. SOLUTION: A plating treatment unit 1 for subjecting a substrate W to treatment relating to plating treatment has the recovering unit 37 which removes the metal ions in the waste liquid by accompanying the treatment. The recovering unit 37 removes the metal ions contained in the waste liquid, by which the discharge of the waste liquid into general waste water is made possible. The waste liquid treatment is merely necessitated to take only the equipment itself into consideration and therefore, the waste liquid treatment is made possible by the simple constitution.
申请公布号 JP2003003297(A) 申请公布日期 2003.01.08
申请号 JP20010185925 申请日期 2001.06.20
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 MATSUBARA HIDEAKI;YANE TAKESHI
分类号 G01N27/06;C02F1/42;C23F1/00;C23F1/46;C25D21/00;C25D21/08;C25D21/16;H01L21/288;(IPC1-7):C25D21/08 主分类号 G01N27/06
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