发明名称 LAPPING APPARATUS AND LAPPING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a lapping apparatus and lapping method to wash cleanly the lapping tool to lap precision optical parts, their molds and the like. SOLUTION: The lapping apparatus 1 is provided with the magnetic field generating part 6 which generates the specified magnetic field and is arranged the specified distance off the surface of the lapping tool 2, and at the upstream side of the washing brush 3 in terms of the rotating direction of the lapping tool 2 so that the magnetized chips 10 sticking to the surface of the lapping tool 2 are ploughed to be completely washed down and removed by the root with the washing brush 3 provided at the downstream side of the rotating direction of lapping tool 2.
申请公布号 JP2003001561(A) 申请公布日期 2003.01.08
申请号 JP20010192232 申请日期 2001.06.26
申请人 RICOH CO LTD 发明人 CHO SUSUMU;ICHIKAWA KENICHI;ENDO HIROYUKI;INADA HISASHI;SAKAE HIDETOSHI
分类号 B24B53/007;(IPC1-7):B24B53/007 主分类号 B24B53/007
代理机构 代理人
主权项
地址