发明名称 EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition preventing deterioration of characteristics of a tantalum element during molding, having excellent temperature cycling properties and especially suitable for sealing a small-sized tantalum capacitor. SOLUTION: This epoxy resin composition for sealing the tantalum element consists essentially of (A) an epoxy resin, (B) a phenol resin, (C) an inorganic filler and (D) a curing agent. The epoxy resin composition gives a cured product prepared by hot curing having characteristics of 0.30-0.60% molding shrinkage and <=14,000 N/mm<2> modulus of elasticity at normal temperature.
申请公布号 JP2003002954(A) 申请公布日期 2003.01.08
申请号 JP20010184258 申请日期 2001.06.19
申请人 SUMITOMO BAKELITE CO LTD 发明人 SAKUMICHI KEIICHI
分类号 C08K3/00;C08G59/62;C08L63/00;H01G9/004;H01G9/08;H01L23/29;H01L23/31;(IPC1-7):C08G59/62 主分类号 C08K3/00
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