| 摘要 |
<p>PURPOSE: A method for mounting a ball grid array(BGA) package is provided to make a solder ball have a sandglass type after a mounting process and to guarantee the reliability of a solder joint of the solder ball by using tape with a hole of a sandglass type. CONSTITUTION: A ball land(11) is formed on a printed circuit board(PCB)(20), corresponding to the solder ball(6). The tape having the hole(50) of a sandglass type in a position corresponding to the solder ball is attached to the PCB so that the ball land is exposed by the hole. Flux is applied on the exposed ball land. The BGA package is so disposed to make the solder ball come in contact with the hole of the tape. The solder ball is reflowed so that the bottom surface of the package comes in contact with the tape while the solder ball flows to the inside of the hole of a sandglass type.</p> |
