HIGHLY THERMAL CONDUCTIVE COMPOSITE MATERIAL AND PRODUCTION METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide an SiC-Cu based highly thermal conductive composite material which is provided with a low thermal expansion coefficient (4.5 to 10×10<-6> /K) and a high thermal conductivity (>=200W/mK), and is optimum for the heat sink and package of electronic equipment at a low cost. SOLUTION: This composite material has a porous SiC perform having a skeleton structure in 20 to 75% by the volume ratio, and Cu is infiltrated therein. The boundary therebetween is provided with a reaction preventive layer. The reaction preventive layer is formed of a thin film of 0.01 to 10μm consisting of carbon or carbide of at least one kind of element selected from Cr, Nb, Ta and W.