| 摘要 |
PROBLEM TO BE SOLVED: To provide a molding resin composition having a superior flowing characteristic capable of yielding a molded article with a low absorption factor and a low coefficient of thermal expansion. SOLUTION: The resin (for example, epoxy resin) contains a filler constituted of three kinds of globular powders consisting of average particle sizes of 0.1μm or larger to 1.5μm or less (x component), 2μm or larger to 15μm or less (y component) and 20μm or larger to 70μm or less (z component), or of the mixtures of these powders and a ground powder (m component). For the molding resin composition, the ratio of x, y and z toward the sum of volumes of x, y and z components is 10 vol.% or more to 24 vol.% or less, 0.1 vol.% or more to 36 vol.% or less and 57 vol.% or more to 76 vol.% or less, respectively, and the ratio of m component toward the sum of weights of x, y, z and m components is 1 wt.% or more to 30 wt.% or less.
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