| 摘要 |
PROBLEM TO BE SOLVED: To provide a connection apparatus, that can be surely connected to a fine pattern having a narrow pitch, which is inexpensive, and can readily improve throughput. SOLUTION: Since a metal small-gauge wire 5 is provided in the horizontal direction in a groove 2 as a probe pin, its positioning can be made in a self- alignment manner. A number of grooves 2 can be formed with a narrow pitch by a fine machining technique, called a well-known micromachining method, thus arranging a number of metal small-gauge wires 5 with a narrow pitch. As a result, narrowing of the pitch of a contact pad in a semiconductor device to be measured can be fully coped with. Additionally, since the positioning of the metal small-gauge wires 5 can be made in a self alignment manner, the positioning is very easy without requiring special needs for a high technique, thus inhibiting cost increase and eliminating the need for accurate machining in a probe board, which conventionally has required high accuracy.
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