| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in resolution, adhesion, sensitivity, plating bath contaminating property, work efficiency, productivity and product stability and useful to increase the density of a printed circuit. SOLUTION: In the photosensitive resin composition containing (A) a polymer binder, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in one molecule, (C) a photopolymerization initiator and (D) an additive, the component (C) is an imidazole dimer and the component (D) carboxybenzotriazole and/or its derivative. |
