| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a laser beam machining device which is capable of cutting an object for machining without the occurrence of melting and a crack deviating from a planned cutting line on the surface of the object for machining. SOLUTION: This laser beam amchining device 100 has a laser beam source 101 which emits a laser beam L below 1μs in pulse width, frequency adjusting means 102 which adjusts the magnitude of the repeating frequencies of the laser beam, condensing means 105 which condenses the laser beam in such a manner that the peak power density of the condensing point P of the emitted laser beam attains >=1×10<8> (w/cm<2> ), means 113 which aligns the condensing point of the laser to the inside of the object 1 for machining, means 109 and 111 which relatively move the condensing point along the planned cutting line 5 and frequency computing means 127 which computes the magnitude of the repeating frequencies of the laser beam in order to adjust the distance between he adjacent reforming spots to the input value. The frequency adjusting means adjusts the magnitude of the repeating frequencies of the laser beam in such a manner that the computed magnitude of the frequencies is attained.</p> |
