发明名称 |
RESIN MOLDING APPARATUS AND RESIN MOLDING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a resin molding apparatus and a resin molding method capable of homogenously transferring a wide transfer surface even in a case having a flow distribution or a temperature distribution at the time of injection filling by providing a means for adjusting the generation place and degree of a sink generated at the time of molding of a resin. SOLUTION: Slits 4a and 4b are formed to a mold 1 and compressed air flows having pressures different by the respective ventilation routes connected to the slits 4a and 4b are sent into a cavity 2 from the slits 4a and 4b during the inflow of a molten resin into the cavity 2 or during and after the inflow of the molten resin. The degree of the sink generated by the solidification and contraction of the resin is adjusted at every slit connected to each of the ventilation routes by locally releasing the adhesion state of the resin and the mold 1.
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申请公布号 |
JP2003001663(A) |
申请公布日期 |
2003.01.08 |
申请号 |
JP20010190653 |
申请日期 |
2001.06.25 |
申请人 |
RICOH CO LTD |
发明人 |
SENOO SHINYA;HATAKEYAMA TOSHIHARU |
分类号 |
B29C45/26;B29C45/00;B29C45/76;(IPC1-7):B29C45/00 |
主分类号 |
B29C45/26 |
代理机构 |
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代理人 |
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地址 |
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