CURED THIN-FILM OF LIQUID EPOXY RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide cured thin-film suitable as an encapsulant for a surface packaging semiconductor device and an encapsulant for a chip light-emitting diode(LED) or a photoconductor. SOLUTION: This thin-film consists essentially of (A) an epoxy resin, (B) a curing agent (C) a curing accelerator and (D) an inorganic filler. The major curing agent (B) is methylnorbornane-2,3-dicarboxylic anhydride and the contents of succinic anhydride in the curing agent (B) is <=0.4 wt.%.