Method for accomodating sensors in a housing

摘要

The active surface (2) of a semiconductor or integrated circuit sensor (1) is covered with a cap (3) enclosing a hollow space (7). After fitting bonded leads (4) the sensor is encapsulated in plastic by casting or injection molding. In a third process, or during encapsulating, the hollow space (7) is opened, e.g. by sawing (8) or drilling after at least partial hardening of the cast material. A light guide can be introduced into the hollow space (7). The leads (4) are attached to a leadframe (6) which is embedded in the housing (5) with the contacts left clear.