METHOD FOR SPLITTING SUBSTRATE AND METHOD FOR PRODUCING LIQUID CRYSTAL DEVICE

摘要

PROBLEM TO BE SOLVED: To achieve a method for producing a liquid crystal device having high productivity by rapid splitting of a substrate using laser cutting. SOLUTION: A scribe groove 1a having a depth of Ds is formed on the surface of a glass substrate 1 having a substrate thickness of (t), and then laser beam is irradiated along the scribe groove 1a to split the substrate 1. By setting the depth Ds [μm] above (200/3) t [mm]+70/3, the substrate 1 is broken by a scribe dominant mode, so that the substrate 1 can be rapidly split with no influence of the scanning speed of the laser beam.