Wafer chuck for supporting a semiconductor wafer

摘要

The invention relates to a wafer chuck (1) for supporting a semiconductor wafer (10) in a lithography device (9). The chuck comprises a wafer support region (2) constructed for contacting a planar wafer surface (11). According to the invention the wafer support region (2) of the chuck (1) comprises recesses (3) allocated at predefined positions (4) corresponding to support member contacting portions (12) of the lower wafer surface (11). A wafer handling system comprises the wafer chuck (1) according to the invention and a wafer holder having wafer support members predefining the support member contacting portions (12) of the wafer surface (11). Elevations on the lower wafer surface like scratches or deposited material which are produced by the contact of the support members (21) and the wafer (10) are encapsulated by the recesses (3) of the wafer chuck according to the invention. Thereby safe contact of the wafer (10) and the wafer support region (2) of the chuck (3) is achieved during lithographic exposure of the wafer.