| 摘要 |
PURPOSE: Provided is a semiconducting, high density polyethylene composition for processed cable having reinforced long-term reliability and extrusion-processing stability and reduced cost. CONSTITUTION: The semiconducting, high density polyethylene composition comprises 80-100 parts by weight of high density polyethylene, 10-20 part by weight of linear, low density polyethylene, as a base resin, 20-40 parts by weight of carbon black, 0.1-0.6 parts by weight of antioxidant, and 0.5-3 parts by weight of polyethylene wax. The high polyethylene composition is a copolymer of alpha-olefin, and has a density of 0.941-0.945 g/cm3, a melting point of 132-138 deg.C, a melting index(MI) of 0.13-0.72 g/10 min. and a degree of crystallinity of 65-95%. |
