| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a sheet for an IC chip adhesion, besides exhibiting a high flame retardant property even on using a bromine-free adhesive resin and having properties associated with reliability such as a heat resistance, humidity resistance, thermal expansion resistance, etc., and an IC chip by using the same. SOLUTION: This sheet for the IC chip adhesion is provided by forming adhesive resin layers on both surfaces of a porous polytetrafluoroethylene layer consisting of a polytetrafluoroethylene sheet. The polytetrafluoroethylene layer keeps porous voids and the adhesive resin layer consists of a bromine-free flame retardant resin composition.</p> |
