| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical packaging substrate which is capable of dealing with the trend toward the higher density of the substrate, does not require optical alignment, can simultaneously send signals from one IC to plural ICs as well and can be improved in the degree of freedom in wiring. SOLUTION: This optical packaging substrate is constituted by forming a substrate layer disposed with a first integrated circuit having light emitting sections from which signal light is emitted and light receiving sections from which the signal light is received by separating at least one second integrated circuits from each other. The substrate includes light transmission layers which function as optical buses to transmit the signal light emitted from the light emitting sections to the light receiving sections and are formed on the rear surface of the substrate layer, first optical elements which are formed in the positions capable of receiving the signal light from the light emitting sections within the light transmission layers and diffuse the emitted signal light into the surface direction in the light transmission layers and second optical elements which are formed in the positions capable of guiding the signal light to the light receiving sections and make the signal light propagating in the light transmission layers to enter toward the light receiving sections. |
