发明名称 LASER WELDING METHOD AND SEMICONDUCTOR LASER MODULE MANUFACTURED BY USING THE METHOD
摘要 <p>PROBLEM TO BE SOLVED: To prevent the deterioration in the strength of welding segments occurring in air bubble and cracks and to reduce the amount of splashing of metals which occurs in cooling weld metal and the residual stress of the welding segments to a smaller level. SOLUTION: In subjecting the areas to be joined of the adjacently arranged metals to laser welding by irradiating the areas with a laser beam, not the power of the laser beam is kept constant from the start of the irradiation till the end of the irradiation but the irradiation of the laser beam is ended after the power of the laser beam is made lower than that at the start of the irradiation, by which the rapid solidification on cooling of the weld metal can be suppressed. As a result, the occurrence of the cracks and air bubbles in the welding segments can be decreased. Also, the amount of splashing of the metals which occurs in cooling the weld metal and the residual stress of the welding segments can be suppressed to the smaller level.</p>
申请公布号 JP2003001452(A) 申请公布日期 2003.01.08
申请号 JP20010182039 申请日期 2001.06.15
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 SEKIGUCHI KAORU
分类号 G02B6/42;B23K26/00;B23K26/06;B23K26/20;B23K26/22;B23K101/40;H01S5/022;(IPC1-7):B23K26/00 主分类号 G02B6/42
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