Wafer scale image sensor package fabrication method

摘要

To form an image sensor package, a series of shallow cuts are made in an interior surface of a window sheet having a plurality of windows. A window support layer is formed on an upper surface of a wafer having a plurality of image sensors. The interior surface of the window sheet is pressed into the window support layer such that the windows are above active areas of the image sensors. The shallow cuts in combination with the window support layer define cavities above bond pads of the image sensors. The window sheet is cut from an exterior surface directly opposite of the cavities above the bond pads to singulating the windows from one another. The wafer is then singulated to form a plurality of image sensor packages.