发明名称 Apparatus and method for providing mechanically pre-formed conductive leads
摘要 The present invention is directed toward an apparatus and method for providing mechanically pre-formed conductive leads. In one embodiment of the invention, an apparatus includes a forming chuck engageable with a first surface of a conductive sheet, and a receiving chuck engageable with a second surface of the conductive sheet opposite from the forming chuck. The forming chuck has a raised forming portion alignable with one or more lead members formed in the conductive sheet, and the receiving chuck has a receiving portion alignable with the forming portion and shaped to closely conform to at least part of the forming portion. The conductive sheet is compressed between the forming chuck and the receiving chuck to mechanically pre-form the one or more lead members into one or more pre-formed conductive leads. In one embodiment, the raised forming portion includes a ridge having a polygonal cross-sectional shape and the receiving portion comprises a channel. Alternately, the raised forming portion includes a partially-pyramidal block and the receiving portion comprises a pocket. In yet another embodiment, the raised forming portion includes a plurality of blocks and the receiving portion comprises a plurality of pockets. In still another embodiment of the invention, an apparatus includes a press coupled to the forming chuck that controllably engages the forming chuck against the conductive sheet. In another embodiment, an apparatus includes a handler for controllably positioning the conductive sheet before and after engagement with the forming and receiving chucks.
申请公布号 US6504257(B1) 申请公布日期 2003.01.07
申请号 US20000718597 申请日期 2000.11.21
申请人 MICRON TECHNOLOGY, INC. 发明人 ELLIS RONALD W.;REYNOLDS TRACY;BETTINGER MICHAEL
分类号 H01L21/48;H01L21/60;H01L21/607;(IPC1-7):H01L29/40 主分类号 H01L21/48
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