发明名称 |
Method and apparatus for decreasing thermal loading and roughness sensitivity in a photoacoustic film thickness measurement system |
摘要 |
Disclosed are methods and apparatus for reducing thermal loading of a film disposed on a surface of a sample, such as a semiconductor wafer, while obtaining a measurement of a thickness of the film in an area about a measurement site. The method includes steps of (a) bringing an optical assembly of the measurement system into focus; (b) aligning a beam spot with the measurement site; (c) turning on one of a dither EOM or a dither AOM or a piezo-electric dither assembly to sweep the beam spot in an area about the measurement site, thereby reducing the thermal loading within the measurement site; (d) making a measurement by obtaining a signal representing an average for the film under the area; (e) recording the measurement data; and (f) analyzing the measurement data to determine an average film thickness in the measurement area.
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申请公布号 |
US6504618(B2) |
申请公布日期 |
2003.01.07 |
申请号 |
US20020092866 |
申请日期 |
2002.03.06 |
申请人 |
RUDOLPH TECHNOLOGIES, INC. |
发明人 |
MORATH CHRISTOPHER;VERTIKOV ANDREY |
分类号 |
G01B11/06;(IPC1-7):G01B11/06 |
主分类号 |
G01B11/06 |
代理机构 |
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地址 |
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