发明名称 Laser cutting method
摘要 A laser cutting method that offers a practically acceptable smooth cut surface without lowering the cutting speed. In this method, a laser beam machining device having a variable-curvature mirror assembly is used. The mirror assembly includes a mirror plate having a convex back side and a front reflecting surface, and a piezo-actuator for deforming the mirror plate to change the curvature of the reflecting surface. A laser beam is produced from the device so as to be reflected by the reflecting surface of the mirror plate and condensed at a focal point. The piezo-actuator is actuated to change the curvature of the reflecting surface, thereby oscillating the focal point along the optical axis of the laser beam at a frequency of between 150 Hz and 300 Hz and an amplitude of between ±0.5 mm and ±3 mm.
申请公布号 US6504130(B1) 申请公布日期 2003.01.07
申请号 US20000656760 申请日期 2000.09.07
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 OKADA TAKESHI
分类号 B23K26/00;B23K26/06;B23K26/08;B23K26/14;B23K26/38;B23K103/02;G02B5/10;G02B7/198;(IPC1-7):B23K26/00 主分类号 B23K26/00
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