发明名称 Electronic module comprising cooling elements for electronic components
摘要 A data acquisition module (1) includes an interconnection board (15) with several electronic components (3, 18) mounted on at least one side of said board. A protective cover (16) mounted opposite said side covers the electronic components (3, 18).In order to cool notably the module's analog-to-digital converters, a piston 41 connected to the protective cover (16) is pressed by a spring (43) against the upper side of at least one electronic component (3) so as to establish a thermal bridge between said electronic component and said protective cover.The piston is mounted in a piston carrier fastened on the cover (16). The diameter of the portion (410) of the piston (41) that is in contact with the electronic component (3) to be cooled is smaller than the diameter of the portion (411) of the piston that is in contact with the piston carrier (40).
申请公布号 US6504722(B2) 申请公布日期 2003.01.07
申请号 US20010896164 申请日期 2001.06.29
申请人 ACQIRIS 发明人 VITTET JEAN-PIERRE;GOUMAZ JEAN-FRANCOIS
分类号 H05K7/14;H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/14
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