发明名称 |
Integrated circuit chip carrier assembly |
摘要 |
An integrated circuit chip carrier assembly is provided by joining a substrate having electrically conductive regions on at least one major surface thereof to a stiffener by a bonding film. The bonding film comprises a dielectric substrate having a thermoset adhesive on both of its major surfaces. The thermoset adhesive prior to the bonding is a B-stage adhesive, is tack-free at normal room temperatures and is solvent free.
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申请公布号 |
US6503821(B2) |
申请公布日期 |
2003.01.07 |
申请号 |
US20010006229 |
申请日期 |
2001.12.10 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FARQUHAR DONALD SETON;JIMAREZ LISA JEANINE;KLODOWSKI MICHAEL JOSEPH;ZIMMERMAN JEFFREY ALAN |
分类号 |
H01L23/12;H01L21/58;H01L23/13;H01L23/498;H01L23/538;H01L25/065;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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