Removable heat transfer apparatus for a pin grid array (PGA) device, and associated installation and removal methods

摘要

A heat transfer apparatus is described for coupling to a pin grid array (PGA) device including an integrated circuit and mounted within a socket (e.g., a zero insertion force or ZIF socket). The socket is mounted upon a surface of a printed circuit board (PCB) and includes two latching projections extending from opposite side surfaces. The heat transfer apparatus includes a thermally conductive heat sink and a spring clip for holding the heat sink in position relative to the PGA device. The heat sink may be made from a metal (e.g., aluminum), and may have multiple structures (e.g., fins or pins) extending from an upper surface. The heat sink has an opening in an underside surface for housing the PGA device and the socket. The heat sink also has a lip surrounding the opening for thermally coupling to the PCB about the socket. The heat sink also has a pair of holes extending through the heat sink from the upper surface of the heat sink into the opening. The spring clip has two side members each adapted for attaching to a different one of the two latching projections of the socket. Each of the pair of holes in the heat sink is positioned to receive a different one of the side members of the spring clip. Methods for coupling a heat sink to the PGA device using the spring clip and removing the installed spring clip are also described.