APPARATUS FOR TRANSFERRING SEMICONDUCTOR WAFER

摘要

PURPOSE: An apparatus for transferring a semiconductor wafer is provided to prevent the wafer from colliding with process equipment or a wafer cassette by using the wafer transfer apparatus including a collision avoidance sensor, and to evaluate the tilt of the wafer transfer apparatus by using a horizontality checking apparatus. CONSTITUTION: A blade(120) fixes to transfer the semiconductor wafer. An approach checking sensor(200) measures a distance between the blade and the process equipment, installed in the blade. The horizontality checking apparatus(300) displays the horizontality of the blade, installed in the blade. A driving unit transfers the blade in a predetermined direction. A control unit controls the operation of the driving unit.