发明名称 |
SUBSTRATE LAPPING APPARATUS, SUBSTRATE LAPPING METHOD AND SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE: To miniaturize a CMP apparatus to reduce the area occupied thereby so that no limitations are encountered with the location when it is installed in a factory shop and the like. CONSTITUTION: In the substrate lapping apparatus to lap the surface of the substrate 1 by rotating both the substrate 1 and the platen 2 together under the condition that the substrate 1 and the polishing cloth 4 adhered to the platen 2 are made to come closely into contact, the moving guide to place the platen 2 on the substrate 1 and move the platen 2 in the direction horizontal to the substrate 1 is provided. The platen 2 is thus made to move relatively to the substrate 1, and the size of the lapping apparatus can be approximately the same as that of the substrate 1.
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申请公布号 |
KR20030001252(A) |
申请公布日期 |
2003.01.06 |
申请号 |
KR20020031483 |
申请日期 |
2002.06.05 |
申请人 |
SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC. |
发明人 |
SATOU YUUJI |
分类号 |
B24B37/005;B24B37/013;B24B37/04;B24B37/10;B24B37/30;H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
B24B37/005 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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