| 摘要 |
<p>A controlled attenuation bonding tool for bonding a fine wire to a substrate. The bonding tool comprises a first cylindrical section (1302) having a substantially uniform first diameter and a second (1304) cylindrical section with a substantially uniform second diameter less than the first diameter. The second cylindrical section is coupled to an end of the first cylindrical section and has a planar area (1303, 1305) along at lest a portion of a length of the second section.</p> |
