| 摘要 |
<p>A method for manufacturing an electronic device comprising, a step for providing a wiring board having first and second different regions on one major surface, a first electronic component having a plurality of first bump electrodes on one major surface, and a second electronic component having a plurality of second bump electrodes having a melting point higher than that of the first bump electrode on one major surface, a step for mounting the first electronic component in the first region on one major surface of the wiring board by fusing the plurality of first bump electrodes, and, a step for mounting the second electronic component in the second region on one major surface of the wiring board by thermocompressing the second electronic component under a state where adhesion resin is placed between the second region on one major surface of the wiring board and one major surface of the second electronic component, wherein the step for mounting the second electronic component is performed prior to the step for mounting the first electronic component.</p> |
