| 摘要 |
Compositions and methods are provided whereby sublamination materials and layers (5) may be produced that comprise a) a single layer etched reference plane (100) having a top surface (120) and a bottom surface(140); b) a first signal layer (160) coupled to the top surface (120) with a first bond-ply material(180); c) a second signal layer (165) coupled to the bottom surface (140) with a second bond-ply material (190); and d) at least one of a through via (195). Printed wiring boards (400) may be produced that comprise a) a substrate layer (410), and b) a sublamination layer (5) laminated onto the substrate layer (410), and c) at least one additional layer (420) coupled to the sublamination layer or material (5). |
