SURFACE TREATMENT AGENT FOR COPPER AND COPPER ALLOY

摘要

A surface treatment agent for copper and a copper alloy which comprises hydrogen peroxide, a mineral acid, an azole, a silver ion and a halogen ion. The surface treatment agent can be used for roughening the surface of a copper or copper alloy article, and allows the formation of a uniformly roughened surface of a copper clad substrate having a plated mirror surface, which has been conventionally difficult. As a result, the surface treatment agent can provide the markedly improved cohesion of such a copper clad substrate with a resin in the case of mounting an electronic component as well as in the case of using an etching resist, a solder resist or a prepreg, and thus is useful in the manufacture of a printed wiring board or the like in the electronic industry.