| 摘要 |
The invention concerns a device for assembling a diode (1) having the shape of a chip and two electrodes (2, 3). The surfaces (5, 6) of the chip form the two contacts of the diode (1), the electrodes (2, 3) are maintained assembled together with each of the two contacts of the diode (1) by elastic means (25) maintained pressed between the two electrodes (2, 3). The second electrode (3) has a heat dissipating function enabling to evacuate the heat generated by a current passing in the diode (1) and the second electrode (3) is common to several diodes (1).
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