ELECTRONIC COMPONENT CONSISTING OF A HOUSING AND A SUBSTRATE

摘要

The invention relates to an electronic component consisting of a housing (1) and a first substrate (2) which has at least one integrated circuit. Several contact surfaces (4) are distributed in an arbitrary manner on the surface of the first substrate (2). The surface of a second substrate (3), which forms a housing, is connected mechanically to the surface of the first substrate (2) by means of an insulating connecting layer (5). Said second substrate (3) has contact connection surfaces (6) which are in direct, electrically conductive contact with the contact surfaces (4) of the first substrate (2), in addition to external contact surfaces (9) positioned symmetrically that are connected in a conductive manner to the contact connection surfaces (6) by means of through contacts (8) in the second substrate (3).