DEVICE FOR APPLYING SOLDER GLOBULES

摘要

The invention relates to a device for applying solder globules to a substrate (7, 9) and for remelting the solder globules onto soldering points (6) of the substrate (7, 9). Said device has a capillary (3) for guiding the solder globule (5) to the soldering point (6) and for placing the soldering globule (5) on the free end (4) of the capillary (3) opposite the smoldering point. The invention also relates to a device for guiding heat to the solder globule (5) in order to remelt said solder globule, and a pressing device (10) for holding down the substrate (7, 9) in order to prevent the substrate (7, 9) from springing back when the solder globule (5) is placed and remelted.