发明名称 Method for removing foreign matter, method for forming film, semiconductor device and film forming apparatus
摘要 A semiconductor substrate is placed within a housing. By supplying organometallic complexes and carbon dioxide in a supercritical state into the housing, a BST thin film is formed on a platinum thin film, while at the same time, carbon compounds, which are produced when the BST thin film is formed, are removed. The solubility of carbon compounds in the supercritical carbon dioxide is very high, and yet the viscosity of the supercritical carbon dioxide is low. Accordingly, the carbon compounds are removable efficiently from the BST thin film. An oxide or nitride film may also be formed by performing oxidation or nitriding at a low temperature using water in a supercritical or subcritical state, for example.
申请公布号 US2003003770(A1) 申请公布日期 2003.01.02
申请号 US20020230258 申请日期 2002.08.29
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 MORITA KIYOYUKI;OHTSUKA TAKASHI;UEDA MICHIHITO
分类号 C23C16/40;C23C16/448;H01L21/28;H01L21/316;H01L29/51;(IPC1-7):H01L51/40;H01L21/31;H01L21/469 主分类号 C23C16/40
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