发明名称 |
Method and apparatus for cutting a semiconductor wafer |
摘要 |
<p>A method for cutting a semiconductor wafer is provided. A mount tape is adhered to a back surface of the semiconductor wafer. The mount tape comprises a resin base and a mesh-like member made of a material harder than that of the resin base and embedded in the resin base. A beam-like liquid jet is ejected toward a front surface of the semiconductor wafer and, simultaneously, a laser beam is transmitted axially through said beam-like liquid jet, so that the semiconductor wafer is cut into individual pieces, by said laser beam, together with the resin base of the mount tape, while the mesh-like member is not cut, but remains in its connected state. <IMAGE></p> |
申请公布号 |
EP1153697(A3) |
申请公布日期 |
2003.01.02 |
申请号 |
EP20010111061 |
申请日期 |
2001.05.08 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO. LTD. |
发明人 |
HIGASHI, MITSUTOSHI;SAKAGUCHI, HIDEAKI |
分类号 |
B23K26/00;B23K26/14;B23K26/18;B23K26/40;B23K101/40;H01L21/301;H01L21/78;(IPC1-7):B23K26/14;H01L21/268;H01L21/302 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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