| 发明名称 |
A carrier head for chemical mechanical polishing a substrate |
| 摘要 |
A carrier head (100b) for a chemical mechanical polishing apparatus includes a flexible membrane (118b) with an expandable mechanical polishing. The lip portion can form or break a seal with the substrate in response to pressure changes in a chamber (190) in the carrier head. <IMAGE> |
| 申请公布号 |
EP1048406(A3) |
申请公布日期 |
2003.01.02 |
| 申请号 |
EP20000303393 |
申请日期 |
2000.04.20 |
| 申请人 |
APPLIED MATERIALS, INC. |
发明人 |
ZUNIGA, STEVEN;CHEN, HUNG |
| 分类号 |
B24B37/30;H01L21/304;(IPC1-7):B24B37/04;H01L21/00;B24B41/06 |
主分类号 |
B24B37/30 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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