| 摘要 |
A process for manufacturing a semiconductor comprising the step of mounting a semiconductor component on a printed circuit board, with electrodes of the semiconductor component facing to electrodes of the printed circuit board, the step of inspecting a function as a semiconductor device with the semiconductor component being mounted on the printed circuit board, the step of bonding the electrodes of the printed circuit board and the electrodes of the mounted semiconductor component to obtain the semiconductor device when the inspection result is good, and the step of replacing at least one of the printed circuit board and the semiconductor component with another one of the same type and again inspecting the function as the semiconductor device when the inspection result is not good. By this method, even if the inspection result is not good, at least one of the printed circuit board and the semiconductor component can be easily removed and replaced with another one, since the function as the semiconductor device is tested with the semiconductor component being mounted on the printed circuit board, thereby preventing the waste of components and increasing the working efficiency. Furthermore, the semiconductor component has, on one side, connection electrode pads to be connected to the electrode of the printed circuit board and also, on the other side opposite to that one side inspection electrode pads so that even when the electrode pads formed on one side of the semiconductor component are in contact with the electrodes of the printed circuit board and thus hidden, the function test can be conducted easily by using the inspection electrode pads formed on the other side of the semiconductor component. <IMAGE> |
