发明名称 |
Integrated ball grid array-pin grid array-flex laminate assembly |
摘要 |
In a preferred embodiment, the present invention comprises an unsealed BGA socket, nail head pins which can be inserted flush into an pin carrier to produce a PGA header, a Flex circuit assembly comprising a piece of flexible circuit with various passive resistors and connectors attached and solder preforms used to solder the flex assembly to the pin grid array.
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申请公布号 |
US2003003780(A1) |
申请公布日期 |
2003.01.02 |
申请号 |
US20010764551 |
申请日期 |
2001.01.18 |
申请人 |
JOHNSON KENNETH W.;HOLCOMBE BRENT A. |
发明人 |
JOHNSON KENNETH W.;HOLCOMBE BRENT A. |
分类号 |
G01R1/04;H05K1/18;H05K3/34;(IPC1-7):H05K1/00 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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