发明名称 |
Wiring substrate having position information |
摘要 |
A wiring board for a semiconductor package comprises a base substrate having first and second surfaces; a wiring layer consisting of necessary wiring patterns formed on at least one of the first and second surfaces; a plurality of semiconductor element mounting areas formed on the surface of the base substrate on which the wiring layer is formed; and individual patterns as position information provided for the respective semiconductor element mounting areas, the individual patterns having a particular shape for the respective semiconductor element mounting area. The individual patterns as position information are formed on peripheral regions of the respective semiconductor element mounting areas.
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申请公布号 |
US2003001256(A1) |
申请公布日期 |
2003.01.02 |
申请号 |
US20020179981 |
申请日期 |
2002.06.26 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
SATO YUKIO;OKU AKIHIRO;AOKI MASAYOSHI |
分类号 |
H01L21/66;H01L23/544;H05K1/02;H05K3/00;H05K3/24;(IPC1-7):H01L23/34 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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