| 摘要 |
A method of fabricating a package for a micro-electromechanical systems (MEMS) device. A flex circuit interconnect subassembly for the package is made by placing a flex circuit on a pad insert, attaching a carrier insert to the pad insert to deflect the lead portions of the flex circuit, and applying a cover insert to the pad insert, after the attachment of the carrier insert, to re-deflect the lead portions of the flex circuit toward the device bond sites. The flex circuit interconnect subassembly may be combined with an electronic device die/carrier subassembly to form a completed electronic device package. The flex circuit interconnect subassembly and the die/carrier subassembly are joined using mechanical interlocking layers. The invention is particularly suited for making such an electronic device die/carrier subassembly which has a MEMS die permanently affixed to a carrier. The carrier is advantageously utilized during the process of releasing a protective coating from the surface of the MEMS die which support the various MEMS components. The MEMS components on the MEMS die are hermetically sealed, such as by bonding a cover to the upper package body or the lower package body. The cover may have features such as ports which allow the MEMS components to interact with the external environment.
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