| 摘要 |
There is provided a cooling device for ICs capable of relatively uniformly cooling multiple ICs which are arranged in the direction of the supply of wind thereto. Multiple ICs are arranged in the direction of the supply of wind produced in a fan on a printed board. Heat sinks each having fins are disposed on the ICs. A cover is mounted onto each heat sink. The cover has an introduction part which is opened in the direction of the supply of wind, and collects the wind so as to introduce the wind into the heat sink. The wind is changed in its direction as a wind by inclined part of the cover, and the wind is introduced into the introduction part of the cover positioned at downstream side, namely, from the position b to the position h. As a result, each heat sink can be cooled relatively uniformly.
|
